Work

Quantitative method evaluating the fatigue life of solder joint and some factors influencing the evaluation

Year: 2010

Type: article

Source: Electronic Components and Materials

Authors: Sun Xiao-jun, Dong Hu, Xie Jinsong, Ling Zhou, Xiaoming Wang

Institution: China Academy of Space Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2392932439

FWCI: 0.238

Cites:

Cited by: 1

Related to: 10