Work

Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

Year: 2016

Type: article

Source: Materials Science and Engineering A

DOI: 10.1016/j.msea.2016.05.092

Authors: Yi Li, Kaiming Luo, Adeline B.Y. Lim, Zhong Chen, Fengshun Wu, Y.C. Chan

Institutions: City University of Hong Kong, Nanyang Technological University, Huazhong University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

OpenAlex ID: W2395743341

FWCI: 2.485

Cites: 42

Cited by: 47

Related to: 10