Work

Electroless Nickel / Electroless Palladium / Immersion Gold Plating Process for Gold- and Aluminum-Wire Bonding Designed for High-Temperature Applications

Year: 2000

Type: article

Authors: Ag Paste, Kuldip Johal, Sven Lamprecht, Hugh Roberts

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2398873471

FWCI:

Cites: 1

Cited by: 7

Related to: 10