Work

Modeling of graphene for interconnect applications

Year: 2016

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc-amc.2016.7507675

Authors: A. Contino, I. Ciofi, M. Politou, D. Verkest, D. Mocuta, B. Soree, G. Groeseneken

Institutions: IMEC, KU Leuven

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2472275433

FWCI: 7.157

Cites: 10

Cited by: 12

Related to: 10