Work

Effects of Al, Pr additions on the wettability and interfacial reaction of Zn–25Sn solder on Cu substrate

Year: 2016

Type: article

Source: Journal of Materials Science Materials in Electronics

DOI: 10.1007/s10854-016-5498-x

Authors: Xi Niu, Kwang-Lung Lin

Institution: National Cheng Kung University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2493558786

FWCI: 1.287

Cites: 34

Cited by: 12

Related to: 10