Work

MID Technology and Mechatronic Integration Potential

Year: 2014

Type: book-chapter

Source: Carl Hanser Verlag GmbH & Co. KG eBooks

DOI: 10.3139/9781569905524.001

Authors: C. Goth, T. Kuhn

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2503514889

FWCI: 1.269

Cites:

Cited by: 1

Related to: 10