Work

Characterization of Extreme Si Thinning Process for Wafer-to-Wafer Stacking

Year: 2016

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2016.102

Authors: Fumihiro Inoue, Anne Jourdain, Joeri De Vos, Erik Sleeckx, Eric Beyne, Jash Patel, Oliver Ansell, Huma Ashraf, Janet Hopkins, Dave Thomas, Akira Uedono

Institutions: IMEC, SPTS Technologies (United Kingdom), University of Tsukuba

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2507501775

FWCI: 3.72

Cites: 9

Cited by: 26

Related to: 10