Work

Solder Joint Reliability: Thermo-mechanical analysis on Power Flat Packages

Year: 2016

Type: book-chapter

Source: Lecture notes in mechanical engineering

DOI: 10.1007/978-3-319-45781-9_71

Authors: Alessandro Sitta, Michele Calabretta, Marco Renna, Daniela Cavallaro

Institutions: University of Catania, STMicroelectronics (Italy)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2509999191

FWCI: 5.234

Cites: 6

Cited by: 14

Related to: 10