Work

Thermal Properties of Silver Nanoparticle Sintering Bonding Paste for High-Power LED Packaging

Year: 2016

Type: article

Abstract: This paper describes the preparation of low-temperature sintered nanosilver paste with inverse microemulsion method with Span-80/Triton X-100 as the mixed-surfactant and analyzes the influence of different sintering parameters (temperature, pressure) on the shear properties of low-temperature sintering of nanosilver. Experimental results show that the shear strength of the low-temperature sintering of nanosilver increases as the temperature and pressure increase. But there are many pores and relative fewer cracks on the sintering layer after low-temperature sintered. The test thermal resistance of low-temperature sintered nanosilver paste is 0.795 K/W which is greater than SAC305 weld layer with a T3ster thermal analyzer. The adhesive performance and the heat dispersion of low-temperature sintered nanosilver paste need to be further researched and improved.

Source: Journal of Nanomaterials

DOI: 10.1155/2016/8681513

Authors: Ping Zhang, Rongzhuan Wei, Jianhua Zeng, Miao Cai, Jing Xiao, Daoguo Yang

Institution: Guilin University of Electronic Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: hybrid

Estimated APC paid: $2,375