Work

The effects of plating current and rotation speed on the microstructural properties of electrochemical plated Cu films

Year: 2016

Type: conference-paper

Source: International Symposium on Next-Generation Electronics

DOI: 10.1109/isne.2016.7543401

Authors: Wei-Lin Wang, Shi-Jun Liu, Ming-Hsin Yeh, Hsien-Chang Kuo, Hung-Ju Chien, Tzung-Hua Ying

Institution: Powerchip (Taiwan)

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Surfaces, Coatings and Films

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2515840486

FWCI:

Cites: 4

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Related to: 10