Work

Thermomigration in Sn‐Pb solder bumps: Modelling and simulation

Year: 2016

Type: article

Source: PAMM

DOI: 10.1002/pamm.201610230

Authors: Stefan Schuß, Christian Hesch, Kerstin Weinberg

Institutions: University of Siegen, Karlsruhe Institute of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2533745652

FWCI:

Cites: 4

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Related to: 10