Work

Design and packaging approach for MMIC insertion in a broadband 4*4 microwave switch matrix

Year: 2003

Type: conference-paper

Source: 10th Annual IEEE (GaAs IC) Symposium, Gallium Arsenide Integrated Circuit. Technical Digest 1988.

DOI: 10.1109/gaas.1988.11071

Authors: R.K. Gupta, H.I. Gerson, P.B. Ross, F.T. Assal

Language: English

Topic: Microwave Engineering and Waveguides

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2535239092

FWCI: 0.449

Cites: 3

Cited by: 11

Related to: 10