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Die attach film (DAF) for Breakthrough in Manufacturing (BIM) application

Year: 2014

Type: conference-paper

Source: IEEE/CPMT International Electronics Manufacturing Technology Symposium

DOI: 10.1109/iemt.2014.7123139

Authors: Premila Krishnan, Yoon Kheong Leong, Fitri Rafzanjani, Nanthakumar Batumalay

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2540259489

FWCI:

Cites: 1

Cited by: 8

Related to: 10