Work

Forming solder filet on leadframe edges of a QFN with immersion tin

Year: 2013

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2013.6745805

Authors: Mustafa Ozkok, Hubertus Mertens, Jerome Bender, Maren Bruder

Institution: Atotech (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2550157722

FWCI: 0.407

Cites:

Cited by: 4

Related to: 10