Work

Evaluating the Effect of SMT Material & Process Variables on Voiding Under QFNs

Year: 2016

Type: conference-paper

Source: IMAPSource Proceedings

DOI: 10.4071/isom-2016-tha52

Authors: Brandon Judd, Maria Durham

Institution: Indium Corporation (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2558355271

FWCI:

Cites:

Cited by:

Related to: 10