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An alternative format for plastic packaging — Wafer/panel level encapsulation: Its challenges and solutions

Year: 2016

Type: conference-paper

Source: IEEE/CPMT International Electronics Manufacturing Technology Symposium

DOI: 10.1109/iemt.2016.7761907

Authors: Kuah Teng Hock, Eric Kuah, Wu Kai, Hao Ji Yuan, Chan Wei Ling, Dam Duc Tai, Ho Shu Chuen

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2561500829

FWCI: 0.93

Cites: 5

Cited by: 3

Related to: 10