Work

Thermal Performance Enhancement of Light Emitting Diode Device with Multilayer-Graphene Transferred to the Substrate Surface

Year: 2017
Type: article
Abstract: The heat centralization of high power light emitting diode becomes a challengeable issue by reason of the strong relationship between device reliability and operating temperature. The purpose of this work is to study the thermal behavior of light emitting diode device with graphene film transferred to the substrate surface. The experiment results show that junction temperature of the device with graphene film transferred to the alumina ceramic substrate surface is about 2.2°C lower. And the thermal resistance is low by 3.11 K/W compared to that of normal device. It is validated that graphene film can improve the thermal conductivity ability of the alumina ceramic substrate. Accordingly, the results are helpful in enhancing the performance and reliability of high power light emitting diode.
Institution: Shanghai University
Language: English
Open Access status: bronze
OpenAlex ID: W2569976181
FWCI: 0.106
Cites: 27
Cited by: 3
Related to: 10