Work

Impact of wafer-bonding defects on Monolithic 3D integrated circuits

Year: 2016

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps.2016.7835425

Authors: Abhishek Koneru, Sukeshwar Kannan, Krishnendu Chakrabarty

Institutions: Duke University, GlobalFoundries (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2581008992

FWCI: 3.25

Cites: 8

Cited by: 23

Related to: 10