One-package epoxy adhesive materials with high heat resistance
Year: 2017
Type: article
Source: Polymer Science Series D
Authors: G. R. Garaeva, S. N. Gladkikh, M. A. Belinskii
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Polymers and Plastics
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2589613449