Work

Pressureless low temperature sintering paste for NiAu PCB substrate

Year: 2016

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2016.7861547

Authors: Yong Ling Xin, Tan Juo Yan, Wolfgang Schmitt, Jens Nachreiner, Chew Ly May

Institution: Heraeus (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2591676402

FWCI: 0.465

Cites: 2

Cited by: 3

Related to: 10