Work

Highly efficient and accurate package electrical modeling automation

Year: 2016

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2016.7861491

Authors: Po-Wei Chiu, Chun-Hung Lin, Hong Shi

Institution: Xilinx (United States)

Language: English

Topic: VLSI and FPGA Design Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2591921046

FWCI:

Cites:

Cited by: 1

Related to: 10