Characterization of anodic bondable LTCC for wafer-level packaging
Year: 2016
Type: conference-paper
Authors: Xiaodong Hu, Manuel Bauscher, Piotr Mackowiak, Yucheng Zhang, Ole Hoelck, Hans Walter, Martin Ihle, Steffen Ziesche, Ulli Hansen, Simon Maus, Oliver Gyenge, Biswajit Mukhopadhyay, Oswin Ehrmann, Klaus-Dieter Lang, Ha-Duong Ngo
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2592906860