R2-TSV: A Repairable and Reliable TSV Set Structure Reutilizing Redundancies
Year: 2017
Type: article
Source: IEEE Transactions on Reliability
Authors: Jaeseok Park, Minho Cheong, Sungho Kang
Institution: Yonsei University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2603758940