Work

Modeling of Via Resistance for Advanced Technology Nodes

Year: 2017

Type: article

Source: IEEE Transactions on Electron Devices

DOI: 10.1109/ted.2017.2687524

Authors: Ivan Ciofi, Philippe J. Roussel, Yves Saad, Victor Moroz, Chia-Ying Hu, Rogier Baert, Kristof Croes, Antonino Contino, Kevin Vandersmissen, Weimin Gao, Philippe Matagne, Mustafa Badaroglu, Christopher J. Wilson, Dan Mocuta, Zsolt Tokei

Institutions: IMEC, Synopsys (United States), KU Leuven

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2605777874

FWCI: 2.721

Cites: 6

Cited by: 70

Related to: 10