Work

Hydrogen thermal reductive Cu nanowires in low temperature Cu–Cu bonding

Year: 2017

Type: article

Source: Journal of Micromechanics and Microengineering

DOI: 10.1088/1361-6439/aa74fb

Authors: Li Du, Tielin Shi, Lei Su, Zirong Tang, Guanglan Liao

Institutions: State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Jiangnan University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Awards: G1030087181, G7380912960

OpenAlex ID: W2619258617

FWCI: 0.447

Cites: 29

Cited by: 10

Related to: 10