Development of Crack Detection Method with 2 Dimensionally Generated 3 Dimensionally Reconstructed Images in THT Solder Joints
Year: 2017
Type: article
Abstract: This work represents an interesting development in the detection and interpretation of crack evolution in through hole technology (THT) solder joints, which based on the development of general and common method. Serial sectioning is a useful method because it overcomes the problems associated with traditional two-dimensional metallographic techniques by providing information about (micro)structures in three-dimensions. In our work, serials sectioning with reconstruction method was utilized to visualize the 3D nature of cracks in through hole solder joint. Accurate quantitive analysis of the cracks, such as crack length, position and extension are presented with a help of the developed method: newly defined parameter and serial-cross sectioning method.
Authors: G. Gergely, D. Koncz-Horváth, Z. Weltsch, Z. Gácsi
Institution: University of Miskolc
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
Funders: European Commission, European Social Fund
OpenAlex ID: W2736937293