Work

Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier

Year: 2017

Type: conference-paper

Source: IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

DOI: 10.1109/nordpac.2017.7993181

Authors: Shirong Huang, Wei Ke, Yiqun Yang, Hui Ye, Shujing Chen, Bo Shan, Jie Bao, Qianlong Wang, Guangjie Yuan, Xiuzhen Lu, Yan Zhang, Yifeng Fu, Lilei Ye, Johan Liu

Institutions: Shanghai University, Huangshan University, Chalmers University of Technology, Smart High Tech (Sweden)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2742856089

FWCI:

Cites: 19

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Related to: 10