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先進相互接続のための多層グラフェンの評価【Powered by NICT】

Year: 2017

Type: article

Source: Microelectronic Engineering

Authors: Politou Maria, Wu Xiangyu, Asselberghs Inge, Contino Antonino, Soree Bart, Radu Iuliana, Cedric Huyghebaert, Zsolt Tőkei, De Gendt Stefan, Heyns Marc

Language: Japanese

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2750100178

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