Work

Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps

Year: 2017

Type: article

Source: Journal of Materials Science Materials in Electronics

DOI: 10.1007/s10854-017-8096-7

Authors: Dongfan Wang, Huiqin Ling, Menglong Sun, Xiaoying Miao, Anmin Hu, Ming Li, Fengwei Dai, Wenqi Zhang, Liqiang Cao

Institutions: Shanghai Jiao Tong University, State Key Laboratory of Metal Matrix Composites, Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Shanghai Jiao Tong University, National Key Research and Development Program of China

Awards: G177135022, G319455243

OpenAlex ID: W2767548484

FWCI: 0.671

Cites: 31

Cited by: 14

Related to: 10