TSV Repair Architecture for Clustered Faults
Year: 2018
Type: article
Authors: Jaewon Jang, Minho Cheong, Sungho Kang
Institution: Yonsei University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G7650393872
OpenAlex ID: W2789587764