Work

Reliability assessment of SiC power module stack based on thermo-structural analysis

Year: 2018

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime.2018.8369879

Authors: Alexey Sokolov, Chunlei Liu, Fabian Mohn

Institution: ABB (Switzerland)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2806440147

FWCI: 2.402

Cites: 7

Cited by: 12

Related to: 10