Work

Research on Fatigue For AlN - Cu Plate Jointed By DBC Method For Semi-Conductor Substrate

Year: 2018
Type: conference-paper
Abstract: A elastic-plastic analysis of AlN/Cu jointing plate was performed by FEM to study the residual stress produced in the jointing-cooling process.This residual stress due to the difference of thermal expansion coefficient between ceramics and metal was analyzed, considering the presence of initial defects in ceramics.A static fatigue life was estimated based on a stress intensity factor of the supper-posed stress of the residual stress and the bending stress in ceramics of AlN/Cu jointing plate with the various thickness of Al2O3 layer.
Authors: Qiao Ling Zhang, Ting Ai, Hao Kang
Language: English
Open Access status: hybrid
OpenAlex ID: W2806775799
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