64‐4: Manufacturing and Encapsulation Process of Bottom Gate Bottom Contact Thin‐Film Transistors with a Printed Oxide Semiconductor
Year: 2018
Type: conference-paper
DOI: 10.1002/sdtp.12255
Authors: Nesrine Kammoun, Yvonne Krieg, Guy Williams Ngaleu, Ralf Anselmann, Gerhard Renner, Norbert Fruehauf
Institutions: University of Stuttgart, Evonik (Germany)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2806907038
