Work

Metallization technology of SiC power module in high temperature operation

Year: 2018

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep.2018.8374326

Authors: Tomohito Iwashige, Kazuhiko Sugiura, Takeshi Endo, Kazuhiko Tsuruta, Yuichi Sakuma, Seigo Kurosaka, Yukinori Oda, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

Institutions: Denso (Japan), The Institute of Scientific and Industrial Research, The University of Osaka, The University of Osaka

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2808026236

FWCI:

Cites: 4

Cited by: 1

Related to: 10