Work

Compensation of Surface Roughness Using an Au Intermediate Layer in a Cu Direct Bonding Process

Year: 2018

Type: article

Source: Journal of Electronic Materials

DOI: 10.1007/s11664-018-6428-x

Authors: Hirokazu Noma, Takumi Kamibayashi, Hiroyuki Kuwae, Naoya Suzuki, Toshihisa Nonaka, Shuichi Shoji, Jun Mizuno

Institutions: Waseda University, Hitachi (Japan), Research Organization for Nano & Life Innovation

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Ministry of Education, Culture, Sports, Science and Technology

Awards: G5153014975, G7922344026

OpenAlex ID: W2808033958

FWCI: 0.666

Cites: 28

Cited by: 13

Related to: 10