Work

Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects

Year: 2015

Type: article

Source: Microelectronic Engineering

DOI: 10.1016/j.mee.2015.04.116

Authors: George Vakanas, O. Minho, Biljana Dimcic, Kris Vanstreels, Bjorn Vandecasteele, Inge De Preter, Jaber Derakhshandeh, Kenneth Rebibis, Masanori Kajihara, Ingrid De Wolf, Eric Beyne

Institutions: Intel (United States), IMEC, Tokyo Institute of Technology, KU Leuven

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W286144375

FWCI: 1.283

Cites: 11

Cited by: 48

Related to: 10