Work

Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating

Year: 2018

Type: article

Source: Journal of Electronic Materials

DOI: 10.1007/s11664-018-6515-z

Authors: Chao Huang, Li Rao, Menglong Sun, Anmin Hu, Ming Li

Institutions: Shanghai Jiao Tong University, State Key Laboratory of Metal Matrix Composites

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Science Foundation, National Natural Science Foundation of China, Shanghai Jiao Tong University, National Key Research and Development Program of China

Awards: G319455243, G5017333603

OpenAlex ID: W2884881202

FWCI: 2.166

Cites: 5

Cited by: 27

Related to: 10