Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers
Year: 2018
Type: conference-paper
Authors: John Lau, Wu Kai, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Winsons Bao, Sze Pei Lim, Rozalia Beica, C.T. Ko, Cao Xi, Ming Li, Yang Lei, Margie Li, Iris Xu, Tony Chen, Sandy Chen, Qing Xiang Yong, Kumar Janardhanan
Institutions: ASM Pacific Technology (China), Dow Chemical (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2885200725