Work

A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration

Year: 2018

Type: conference-paper

Source: IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

DOI: 10.1109/edtm.2018.8421528

Authors: SeungNam Son, HoDol Yoo, Ji Hyun Kim, JooHyun Kim, DooWon Lee, WonChul Do, Yun Ra, KwangSup So, WooHyun Paik, KangWook Lee

Institution: LG (South Korea)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2886857585

FWCI: 0.799

Cites: 1

Cited by: 3

Related to: 10