Heterogeneous Integration Challenges Within Wafer Level Fan-Out SiP for Wearables and IoT
Year: 2018
Type: conference-paper
Authors: Alberto Martins, Marcio Pinheiro, Ana Filipa Ferreira, Rodrigo Almeida, Filipe Matos, Joana Oliveira, Rui Pedro Silva, Hugo Santos, Manual Monteiro, Hugo Gamboa
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2886973230