Extreme Thinning of Si Wafers for Via-Last and Multi-wafer Stacking Applications
Year: 2018
Type: conference-paper
Authors: Anne Jourdain, Joeri De Vos, Nouredine Rassoul, Houman Zahedmanesh, Andy Miller, Gerald Beyer, Eric Beyne, Edward Walsby, Jash Patel, Oliver Ansell, Huma Ashraf, Dave Thomas, Shifang Li, Timothy Chang, Stephen Hiebert, Moritz Stoerring, Andrew Cross
Institutions: IMEC, SPTS Technologies (United Kingdom), KLA (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2887841772