Sc2W3O12/Cu composites with low thermal expansion coefficient and high thermal conductivity for efficient cooling of electronics
Year: 2018
Type: article
Source: Journal of Alloys and Compounds
Authors: Shuai Gao, Nan Zhao, Qinqin Liu, Yi Li, Guifang Xu, Xiaonong Cheng, Juan Yang
Institutions: Jiangsu University, Jiangsu University Jingjiang College
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
Awards: G2990988654, G5541884363, G8137614475
OpenAlex ID: W2901115995
