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Sc2W3O12/Cu composites with low thermal expansion coefficient and high thermal conductivity for efficient cooling of electronics

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Year: 2018
Type: article
Source: Journal of Alloys and Compounds
DOI: 10.1016/j.jallcom.2018.11.131
Authors: Shuai Gao, Nan Zhao, Qinqin Liu, Yi Li, Guifang Xu, Xiaonong Cheng, Juan Yang
Institutions: Jiangsu University, Jiangsu University Jingjiang College
Language: English

Topic: Thermal properties of materials
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences

Open Access status: closed

Funders: National Science Foundation, National Natural Science Foundation of China, Senior Talent Foundation of Jiangsu University, Natural Science Research of Jiangsu Higher Education Institutions of China
Awards: G2990988654, G5541884363, G8137614475
OpenAlex ID: W2901115995
FWCI: 1.535
Cites: 32
Cited by: 52
Related to: 10
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