Work

Cu-In fine-pitch-interconnects: influence of processing conditions on the interconnection quality

Year: 2018

Type: conference-paper

Source: Electronic System-Integration Technology Conference (ESTC)

DOI: 10.1109/estc.2018.8546413

Authors: Steffen Bickel, Shawon Sen, Jorg Meyer, Iuliana Panchenko, M. Jurgen Wolf

Institutions: Technische Universität Dresden, All Silicon System Integration Dresden, Fraunhofer Institute for Reliability and Microintegration

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2902269727

FWCI: 1.998

Cites: 10

Cited by: 12

Related to: 10