Work

Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost

Year: 2018

Type: conference-paper

Source: IMAPSource Proceedings

DOI: 10.4071/2380-4505-2018.1.000037

Authors: Henning Hübner, Christian Ohde, Dirk Ruess

Institution: Atotech (Germany)

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Surfaces, Coatings and Films

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2904510282

FWCI: 1.482

Cites: 2

Cited by: 2

Related to: 10