Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic Rf Mems/Cmos
Year: 2018
Type: conference-paper
Authors: Rameen Hadizadeh, Anssi Laitinen, David Molinero, Nelson Pereira, Marcio Pinheiro
Institution: Amkor Technology (Portugal)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2904883963