Data retention investigation in Al:HfO2-based resistive random access memory arrays by using high-temperature accelerated tests
Year: 2019
Type: article
Abstract: In this work, the feasibility of using accelerated tests at high temperatures to assess the data retention on resistive random access memory devices was evaluated on Al:HfO2-based 1-transistor-1-resistor 4 kbit arrays. By annealing the samples at four different temperatures (190, 210, 230, and 260°C) for 10 h, different distributions of retention failure times were obtained and modeled by using Weibull distributions. Based on the temperature dependency of these distributions, the Arrhenius activation energy of the degradation process was calculated (1.09 eV). In addition, the maximum temperature that guarantees a retention time to failure of a 10 year lifetime was extrapolated (105°C).
DOI: 10.1116/1.5054983
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
Funder: Deutsche Forschungsgemeinschaft
Award: G2046555355
OpenAlex ID: W2906825971
