Breakthroughs in 3D Sequential technology
Year: 2018
Type: conference-paper
Authors: L. Brunet, C. Fenouillet-Beranger, P. Batude, S. Beaurepaire, F. Ponthenier, N. Rambal, V. Mazzocchi, J-B. Pin, P. Acosta-Alba, S. Kerdiles, P. Besson, H. Fontaine, T. Lardin, F. Fournel, V. Larrey, F. Mazen, V. Balan, C. Morales, C. Guerin, V. Jousseaume, X. Federspiel, D. Ney, X. Garros, A. Roman, D. Scevola, P. Perreau, F. Kouemeni-Tchouake, L. Arnaud, C. Scibetta, S. Chevalliez, F. Aussenac, J. Aubin, S. Reboh, F. Andrieu, S. Maitrejean, M. Vinet
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2913596336
