Year: 2008
Type: conference-paper
Abstract: We report on the design, fabrication and testing of the first low-cost CMOS monolithically-integrated three-axis accelerometer based on thermal convection.A novel single sensor element measures accelerations in all three axes.Differential temperature readout is used in the X-Y axis and pseudo-differential mode readout is used for the Z-axis.On-chip, low-noise, analog electronics are used to pre-amplify and condition sensor signals prior to on-chip digital calibration and compensation.This device has a bandwidth of 10 Hz in all three axes, noise floor of 0.1mg/ Hz in the X-Y axis and 1.5 mg/ Hz in the Z-axis.Nonlinearity in the X, Y, and Z axes is less than 5% of full scale.The 3-axis die is 30% smaller in area than our current 2-axis production die and device power remains unchanged at 6mW.
Authors: Y. Cai, M. Varghese, A. Dribinsky, Y. Hua, F. Lu, H. Gu, M. Meng, W. Zhang, L. Jiang, A. Leung, Y. Zhao, G. O'Brien, G. Pucci, H. Liupuddin
Institution: Simon Fraser University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W2932648878