Work

Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive process

Year: 2019

Type: conference-paper

Source: IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

DOI: 10.23919/nordpac.2019.8760349

Authors: Sarthak Acharya, Shailesh Singh Chouhan, Jerker Delsing

Institution: Luleå University of Technology

Language: English

Topic: Laser Material Processing Techniques

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2962478249

FWCI: 0.401

Cites: 4

Cited by: 2

Related to: 10