Work

Rate controlled sintering: A novel approach to improve quality and yield of die-attach interconnects

Year: 2019

Type: conference-paper

Source: IEEE International Workshop on Integrated Power Packaging (IWIPP)

DOI: 10.1109/iwipp.2019.8799103

Authors: Simon Merkert, Aaron Hutzler, Thomas Krebs

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2967508261

FWCI:

Cites: 2

Cited by:

Related to: 10